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IDC/Server/Workstation Liquid Cooling Solutions

IDC Server Workstation Liquid Cooling Solutions

For IDCs, servers, and workstations, Lineng Tech utilizes liquid cold plates for heat dissipation. This approach offers superior cooling performance compared to traditional air cooling, ensures effective contact with heat sources, lowers device temperatures, and enhances system stability.

Additional advantages include a compact form factor, low noise levels, high scalability, and brazed cold plate construction which significantly reduces leakage risk.

Lineng Tech cold plates are available in both open-loop and closed-loop configurations for various application requirements.

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Server Closed-Loop Liquid Cooling System

Server Closed-Loop Liquid Cooling System

Cold Plate / Copper Base Microchannel Introduction

Cold Plate Copper Base Microchannel Introduction 1
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Parameters

Pressure Drop: Low
Power Density: High
Cost: Relatively High
Application: Data center CPU
Cold Plate Copper Base Microchannel Introduction
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Parameters 

Pressure Drop: Medium
Power Density: Low
Cost: Medium
Application: Large-scale Solar Thermal Series
Cold Plate Copper Base Microchannel Introduction 2
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Parameters 

Pressure Drop: Low
Power Density: Medium
Cost: Low
Application: Low-power, Small-form-factor, Current-limited Devices

Custom Solutions, Tailored for Your Business

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