Welding
INQUIRY
Welding Process: Molecular-level Fusion of the Thermodynamic Architecture of the Radiator
As the core component of the radiator, the atomic-level bonding technology we specialize in addressing is:
● Laser seamless welding of heat pipes and fins (thermal resistance < 0.01℃·cm²/W)
● Vacuum diffusion welding of microchannel cold plates (pressure resistance 30Bar)
● Copper-aluminum heterogeneous metal transition connection (shear force ≥ 310MPa)
By precisely controlling the reorganization process of the metal lattice, we construct zero-defect heat transfer paths, making them the lifeline of the radiator in extreme conditions.
The Triple Performance Revolution of Welding Technology
1. Breakthrough in Strength and Precision of Unprecedented Scale
● Parameters: Technical Implementation Industry Benchmark
● Weld depth-to-width ratio:10:1 Laser deep penetration welding ≤5:1
● Heat affected zone width:80μm Pulse modulation technology 300-500μm
● Position repeatability accuracy:±5μm Six-axis robot collaboration ±0.1mm
2. Thermal-Force Coupling Limit Expansion
● Copper-aluminum molecular transition layer thickness controlled to 2-3μm, eliminating electrochemical corrosion risks
● Microchannel cold plate flow channel welding has a sealing performance of 10⁹ Pa·m³/s (helium leak detection level)
● Weld seam fatigue life exceeds 500,000 cycles under high-frequency vibration conditions
Welding Process: Molecular-level Fusion of the Thermodynamic Architecture of the Radiator
As the core component of the radiator, the atomic-level bonding technology we specialize in addressing is:
● Laser seamless welding of heat pipes and fins (thermal resistance < 0.01℃·cm²/W)
● Vacuum diffusion welding of microchannel cold plates (pressure resistance 30Bar)
● Heterogeneous metal transition connection between copper and aluminum (shear force ≥ 310MPa)
By precisely controlling the reorganization process of the metal lattice, we construct zero-defect heat transfer paths, making them the lifeline of the radiator in extreme conditions.
