Skived Fin

The turning of fin plates employs a complete metal substrate micro-cutting process (substrate: C1100 oxygen-free copper / 6061-T6 aluminum alloy). Through nanometer-level precision CNC milling, high-density fin array (40-120 fins/inch) is directly cut into the substrate to achieve a coordinated optimization of heat dissipation area and structural strength.

● Micro-slot forming technology: High-frequency oscillation cutting of hard alloy tools (amplitude ±5 μm), achieving a thickness of 0.3mm for ultra-thin fins (tolerance ±0.015mm)

● Thermal deformation suppression: Low-temperature nitrogen gas jet cooling, maintaining substrate temperature ≤ 80℃ (ΔT < 2℃)

● Zero thermal resistance interface: Atomic-level metal bonding between fins and substrate (thermal conductivity 398 W/m·K @ Cu)

● Comparison of bonding/pressing process: Interface thermal resistance reduced by 98% (<0.03℃/W)

● Heat flux capacity: ≥ 200W/cm² (applicable to server CPUs/GPUs)

● The edge of the fin has a 25° asymmetric bevel, and the forced convective heat transfer coefficient is increased to 450 W/m²K.

● The wind resistance has been reduced by 18% (compared to straight fins)

● Double-sided staggered fin layout (bionic flexible core tube structure), the heat dissipation volume efficiency is increased by 6.2 times

● Support for surface conforming (minimum curvature radius R = 2.5mm)

● Thermal cycling test (-40℃ to 125℃) > 5000 cycles without deformation

● Vibration condition (20G @ 500Hz) - no structural failure occurred

Can integrate 0.5mm micro-liquid cooling channels, achieving dual-mode gas-liquid heat dissipation